Surface Finishing Technology and Semiconductor Fabrication Process. Wet Cleaning Technology for Silicon Wafer.
نویسندگان
چکیده
منابع مشابه
The Evolution of Silicon Wafer Cleaning Technology
The purity of wafer surfaces is an essential requisite for the successful fabrication of VLSI and ULSI silicon circuits. Wafer cleaning chemistry has remained essentially unchanged in the past 25 years and is based on hot alkaline and acidic hydrogen peroxide solutions, a process known as "RCA Standard Clean." This is still the primary method used in the industry. What has changed is its implem...
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In this paper, we report on the removal of photoresist, post-etch process residues and particles for various patterned semiconductor wafers using supercritical carbon dioxide (SCCO2)/chemical modifier formulations. Optimization of the chemical formulations was determined using data obtained from statistical analysis and designed experiments. Characterization of the processed samples via scannin...
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This paper is concerned with assessing the impact that scheduling can have on the performance of semiconductor wafer fabrication facilities. The performance measure considered here is the mean throughput time (sometimes called cycle time, turnaround time or manufacturing interval) for a lot of wafers. A variety of input control and sequencing rules are evaluated using a simulation model of a re...
متن کاملInvited paper Semiconductor cleaning technology for next generation material systems
This paper gives a brief overview of the challenges wafer cleaning technology is facing in the light of advanced silicon technology moving in the direction of non-planar device structures and the need for modified cleans for semiconductors other than silicon. In the former case, the key issue is related to cleaning and conditioning of vertical surfaces in next generation CMOS gate structure as ...
متن کاملUltrasonic Cleaning and Surface Finishing
Careful preparation and cleaning of various types of components is indispensable prior to their surface treatment or final assembly. Various surface treatment operations that require such care include vacuum deposition, electrodeposition, electroless deposition, various dip coatings, etc. Surface preparation is essential for achieving good and firmly adhered coatings. Trace of residual surface ...
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ژورنال
عنوان ژورنال: Journal of the Surface Finishing Society of Japan
سال: 1998
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.49.242